Note: This model is made for generic ABS filament with a precise fit after shrinkage. PLA does not shrink as much. If you want to print a case with PLA I recommend my other version made specificly for PLA. You CAN print this model with PLA at 99.8-99.9 % size but some holes might be roughly 0.2-0.5 mm of center.
Rugged version example:
0.16 mm layer height, 30% infill, 6 top & bottom layers (1 mm).
Recomended supports:
20 threshold angle, Tree(auto)
!! CAUTION !!
The fit of this model is very tight ! Once on, it is not easy to remove from the phone without breaking the case (the 3D print) !
To get it on to the phone it is recommended to start at the long side furthest away from the camera module and then flex the case to slide over the other corners one at a time.
Observe that there are no ports for the speaker, mic or the headphone jack. These will be added to a later version. The speaker and mic sound quality is unaffected.
| REDMI_13C_V2.stl | 1.1MB |
