Bondtech BMG MK3S And MK3 DissEd 3D Printer Model

Author: @
License: CC BY-NC-SA
File formats: step,stl
Download type: zip
Size:2.8MB

The file 'Bondtech BMG MK3S And MK3 DissEd 3D Printer Model' is (step,stl) file type, size is 2.8MB.

Summary

MK3S extruder body adapted to fit bmg and both mk3 and mk3s sensors. No need to reprint the body if you want to change to mk3s IR sensor.

The IR sensor module is an adaptation of bondtech solution for their mk3 bondtech upgrade. I haven't, and can't, test it, but It should work just as well as theirs. The module for the laser sensor works perfectly and is the one I am using right now.

I did this extruder version to stay up to date with the extruder body and since I haven't decided on moving to the new sensor It gives me the chance of doing it pretty easy in the future.

The assembly process is more or less the same as prusa's mk3s extruder body, so I recommend following their instruccions.

1- Install PINDA sensor in first place.
2- Then BMG+E3D+Pancake.
3- Extruder cover.
4- X-carriege
5- Noctua
6- Filament sensor module.
7- fan shroud and fan holder.
and follow prusa documentation.

**This Extruder version will only work with a pancake stepper

Extruder_Body_DissEd_S.step 657.4KB
Extruder_Body_DissEd_S.stl 1.1MB
Extruder_Cover_DissEd_S.step 586.8KB
Extruder_Cover_DissEd_S.stl 1.2MB
Fan_Holdert_DissEd_S.step 79.2KB
Fan_Holdert_DissEd_S.stl 71.2KB
Fan_Shroud_Prusa.stl 2.2MB
IR_Sensor_Cover_DissEd_S.step 38.3KB
IR_Sensor_Cover_DissEd_S.stl 84.1KB
IR_Sensor_Housing_Bondtech_DissEd_S.step 304.7KB
IR_Sensor_Housing_Bondtech_DissEd_S.stl 404.3KB
IR_Sensor_Lever_Bondtech_DissEd_S.step 31.4KB
IR_Sensor_Lever_Bondtech_DissEd_S.stl 57.6KB
Laser_Sensor_Cover_DissEd_S.step 38.4KB
Laser_Sensor_Cover_DissEd_S.stl 111.5KB
Laser_Sensor_DissEd_S.step 149.4KB
Laser_Sensor_DissEd_S.stl 280.2KB
x-carriage-back.stl 466.1KB
X_Carriege_DissEd_S.step 932.3KB
X_Carriege_DissEd_S.stl 388.9KB