The file 'Bondtech BMG MK3S And MK3 DissEd 3D Printer Model' is (step,stl) file type, size is 2.8MB.
MK3S extruder body adapted to fit bmg and both mk3 and mk3s sensors. No need to reprint the body if you want to change to mk3s IR sensor.
The IR sensor module is an adaptation of bondtech solution for their mk3 bondtech upgrade. I haven't, and can't, test it, but It should work just as well as theirs. The module for the laser sensor works perfectly and is the one I am using right now.
I did this extruder version to stay up to date with the extruder body and since I haven't decided on moving to the new sensor It gives me the chance of doing it pretty easy in the future.
The assembly process is more or less the same as prusa's mk3s extruder body, so I recommend following their instruccions.
1- Install PINDA sensor in first place.
2- Then BMG+E3D+Pancake.
3- Extruder cover.
4- X-carriege
5- Noctua
6- Filament sensor module.
7- fan shroud and fan holder.
and follow prusa documentation.
**This Extruder version will only work with a pancake stepper
Extruder_Body_DissEd_S.step | 657.4KB | |
Extruder_Body_DissEd_S.stl | 1.1MB | |
Extruder_Cover_DissEd_S.step | 586.8KB | |
Extruder_Cover_DissEd_S.stl | 1.2MB | |
Fan_Holdert_DissEd_S.step | 79.2KB | |
Fan_Holdert_DissEd_S.stl | 71.2KB | |
Fan_Shroud_Prusa.stl | 2.2MB | |
IR_Sensor_Cover_DissEd_S.step | 38.3KB | |
IR_Sensor_Cover_DissEd_S.stl | 84.1KB | |
IR_Sensor_Housing_Bondtech_DissEd_S.step | 304.7KB | |
IR_Sensor_Housing_Bondtech_DissEd_S.stl | 404.3KB | |
IR_Sensor_Lever_Bondtech_DissEd_S.step | 31.4KB | |
IR_Sensor_Lever_Bondtech_DissEd_S.stl | 57.6KB | |
Laser_Sensor_Cover_DissEd_S.step | 38.4KB | |
Laser_Sensor_Cover_DissEd_S.stl | 111.5KB | |
Laser_Sensor_DissEd_S.step | 149.4KB | |
Laser_Sensor_DissEd_S.stl | 280.2KB | |
x-carriage-back.stl | 466.1KB | |
X_Carriege_DissEd_S.step | 932.3KB | |
X_Carriege_DissEd_S.stl | 388.9KB |